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  1. Home
  3. Through Silicon Mems Inspection With A Near-infrared Laser Scanning Setup.
  1. Home
  3. Through Silicon Mems Inspection With A Near-infrared Laser Scanning Setup.

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Through Silicon MEMS Inspection with a Near-Infrared Laser Scanning Setup.

Manuel J L F Rodrigues1, Inês S Garcia1, Joana D Santos1

  • 1International Iberian Nanotechnology Laboratory, Avenida Mestre José Veiga, 4715-330 Braga, Portugal.

Sensors (Basel, Switzerland)
|August 14, 2025

View abstract on PubMed

Summary
This summary is machine-generated.

This study introduces a novel laser scanning technique for non-destructively inspecting micro-electro-mechanical systems (MEMS). The method uses near-infrared light to detect structural variations without damaging the encapsulated microstructures.

Keywords:
IR Inspection toolMEMSnanometrology

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Area of Science:

  • Materials Science
  • Optical Engineering
  • Microtechnology

Background:

  • Traditional inspection of encapsulated micro-electro-mechanical systems (MEMS) often involves destructive testing, compromising sample integrity.
  • A need exists for non-destructive evaluation (NDE) methods suitable for silicon-encapsulated microstructures.

Purpose of the Study:

  • To present a novel laser scanning setup for the non-destructive inspection of silicon-encapsulated MEMS devices.
  • To validate the concept through preliminary experimental results.

Main Methods:

  • Utilizing a laser scanning setup to measure minute variations in transmitted light intensity within the near-infrared (NIR) spectrum.
  • Leveraging the optical transparency of silicon in the NIR range and Fresnel reflections at material interfaces for contrast generation.
  • Characterizing the system's small feature resolution using standard targets.

Main Results:

  • Demonstrated the capability of the laser scanning setup to perform non-destructive inspection of MEMS devices.
  • Experimental inspection of a MEMS latching device enclosed in silicon covers was successfully performed.
  • Measured contrast values were compared with theoretical predictions, showing good agreement.

Conclusions:

  • The developed laser scanning technique offers a viable non-destructive method for inspecting encapsulated MEMS devices.
  • The approach eliminates the need for sample preparation or potential damage, preserving structural integrity.
  • This method holds promise for quality control and failure analysis in MEMS manufacturing.