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Design and Fabrication of Embedded Microchannel Cooling Solutions for High-Power-Density Semiconductor Devices
Yu Fu1,2, Guangbao Shan1, Xiaofei Zhang3
1School of Microelectronics, Xidian University, Xi'an 710126, China.
Micromachines
|August 28, 2025
Summary
Advanced microchannel cooling effectively manages extreme heat from high-power semiconductor devices. This solution integrates micropillar arrays for superior thermal performance, crucial for next-generation electronics.
Area of Science:
- Materials Science
- Mechanical Engineering
- Electrical Engineering
Background:
- Conventional thermal management fails for high-power semiconductor devices due to extreme heat fluxes.
- Need for advanced cooling solutions to prevent device failure and ensure performance.
Purpose of the Study:
- To present and implement an embedded microchannel cooling solution using micropillar arrays.
- To address extreme heat dissipation challenges in next-generation electronic devices.
Main Methods:
- Finite element analysis for thermo-fluid-structure simulations of micropillar arrays.
- Fabrication using deep reactive ion etching (DRIE), surface functionalization, and Au-Sn eutectic bonding.
- Experimental validation on a test platform up to 1200 W/cm² heat fluxes.
Main Results:
- Embedded microchannel cooling with micropillar arrays achieved efficient heat dissipation.
- Device operating temperature maintained at 46.7 °C with a 27.9 K temperature rise.
- Demonstrated exceptional thermal management capabilities under extreme heat loads.
Conclusions:
- The developed microchannel cooling solution is a feasible and efficient pathway for extreme heat dissipation.
- Offers valuable insights into structural design, micro/nanofabrication, and experimental validation for advanced thermal management.
- Enables reliable operation of high-power-density semiconductor devices.
