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Real-Time DC-dynamic Biasing Method for Switching Time Improvement in Severely Underdamped Fringing-field Electrostatic MEMS Actuators
Published on: August 15, 2014
Push-Push Electrothermal MEMS Actuators with Si-to-Si Contact for DC Power Switching Applications
Abdurrashid Hassan Shuaibu1, Almur A S Rabih1, Yves Blaquière1
1Department of Electrical Engineering, École de Technologie Supérieure, Université du Québec, Montréal, QC H3C 1K3, Canada.
This study introduces a novel silicon-to-silicon Micro-Electro-Mechanical Systems (MEMS) switch for DC power applications. The new design offers low contact resistance and high breakdown voltage, enhancing reliability for power switching.
Area of Science:
- Electrical Engineering
- Materials Science
- Mechanical Engineering
Background:
- Micro-Electro-Mechanical Systems (MEMS) switches offer advantages like compact size and high isolation over traditional switches.
- Existing MEMS switches face challenges in reliability and performance for DC power applications.
Purpose of the Study:
- To present a novel silicon-to-silicon (Si-to-Si) MEMS switch with dual suspended chevron actuators for DC power switching.
- To enhance the reliability and performance of MEMS-based DC power switches through a robust silicon design.
Main Methods:
- Fabrication of the Si-to-Si MEMS switch using the PiezoMUMPs process.
- Testing of the fabricated device to evaluate actuation voltage, power consumption, contact resistance, response time, and breakdown voltage.
Main Results:
- The switch achieved contact closure at 1.1 VDC with 246 mW actuation power.
- Demonstrated low contact resistance (~294 ± 2 Ω) and fast response times (4 ms turn-on, 2.5 ms turn-off).
- Withstood a breakdown voltage of up to 376 V across the contact gap.
Conclusions:
- The novel Si-to-Si MEMS switch shows significant potential for high-voltage DC power switching applications.
- The design's robustness and low contact resistance contribute to enhanced reliability.
- Further enhancements can improve performance in demanding environments.
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