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Related Concept Videos

Mechanisms of Heat Transfer II01:20

Mechanisms of Heat Transfer II

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In convection, thermal energy is carried by the large-scale flow of matter. Ocean currents and large-scale atmospheric circulation, which result from the buoyancy of warm air and water, transfer hot air from the tropics toward the poles and cold air from the poles toward the tropics. The Earth’s rotation interacts with those flows, causing the observed eastward flow of air in the temperate zones. Convection dominates heat transfer by air, and the amount of available space for the airflow...
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Mechanisms of Heat Transfer01:14

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Heat transfer between the human body and its environment occurs through four main mechanisms: conduction, convection, radiation, and evaporation.
Conduction, accounting for approximately 3% of body heat loss at rest, is the process of exchanging heat between molecules of two materials in direct contact. This can result in both heat loss and gain. For instance, when the body is submerged in water, which conducts heat 20 times more effectively than air, it can either lose or gain significant...
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Mechanisms of Heat Transfer I01:14

Mechanisms of Heat Transfer I

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Just as interesting as the effects of heat transfer on a system are the methods by which the heat transfer occur. Whenever there is a temperature difference, heat transfer occurs. It may occur rapidly, such as through a cooking pan, or slowly, such as through the walls of a picnic ice box. So many processes involve heat transfer that it is hard to imagine a situation where no heat transfer occurs. Yet, every heat transfer takes place by only three methods: conduction, convection, and radiation.
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Mechanism of heat transfer01:19

Mechanism of heat transfer

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Understanding heat transfer mechanisms is essential for understanding how our bodies maintain balance in different environmental conditions. When the environment is thermoneutral, the body is in a state of balance, neither using nor releasing energy to maintain its core temperature. However, when the environment is not thermoneutral, the body employs four heat transfer mechanisms to maintain homeostasis: conduction, convection, evaporation, and radiation. These mechanisms facilitate heat...
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Thermal Stress01:09

Thermal Stress

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If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...
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Thermal expansion and Thermal stress: Problem Solving01:27

Thermal expansion and Thermal stress: Problem Solving

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San Francisco's Golden Gate Bridge is exposed to temperatures ranging from -15 °C to 40 °C. At its coldest, the main span of the bridge is 1275 m long. Assuming that the bridge is made entirely of steel, what is the change in its length between these temperatures?
To solve the problem, first, identify the known and unknown quantities. The initial length (L) of the bridge is 1275 m, the coefficient of linear expansion (α) for steel is 12 x 10-6/°C, and the change in temperature (ΔT) is 55...
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Beyond Conventional Cooling: Advanced Micro/Nanostructures for Managing Extreme Heat Flux.

Yuankun Zhang1, Huajie Li1, Yuhang Zhou1

  • 1Centre for Omniscale Thermal Management and Comprehensive Energy Utilization (OTM-EU), School of Airspace Science and Engineering, Shandong University, Weihai, 264209, China.

Advanced Materials (Deerfield Beach, Fla.)
|November 17, 2025
PubMed
Summary
This summary is machine-generated.

Micro/nanostructures offer advanced thermal management for high heat-flux electronics, improving performance and safety. This review covers their mechanisms, applications, and future potential in electronic thermal management.

Keywords:
advanced design and manufacturingheat transfer mechanismmetamaterialmicro/nanostructurestargeted thermal management

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Area of Science:

  • Materials Science
  • Thermal Engineering
  • Nanotechnology

Background:

  • Increasing device integration leads to significant thermal losses, impacting electronic device performance and safety.
  • Advanced thermal management solutions are crucial for high heat-flux electronics to dissipate heat effectively.
  • Micro/nanostructures show promise for targeted heat dissipation due to their performance and design flexibility.

Purpose of the Study:

  • To systematically review heat transfer control mechanisms using micro/nanostructures.
  • To explore current and potential applications of micro/nanostructures in electronic thermal management.
  • To summarize design and manufacturing methods, challenges, and future prospects.

Main Methods:

  • Systematic examination of fundamental heat transfer mechanisms at multiscales.
  • Highlighting bio-inspired and engineered micro/nanostructure designs.
  • Elaboration on novel micro/nano-patterns for coupled heat transfer modulation.

Main Results:

  • Micro/nanostructures enable efficient thermal and hydrodynamic metamaterials.
  • Novel patterns significantly modulate heat transfer processes in electronic thermal management.
  • Comparative summary of strengths and limitations of existing design and manufacturing methods.

Conclusions:

  • Micro/nanostructures hold transformative potential for reliable and sustainable thermal management in high-performance electronics.
  • Further research into design, manufacturing, and application is needed.
  • These structures are key to future advancements in electronic thermal management.