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Ultralow P-Type Contact Resistance Enabled by Evaporated SnS Contacts
Ying Zhang1,2, Huiting Wang1,2, Chang Liu1,3
1State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China.
Researchers developed a new semiconductor-semiconductor contact using tin sulfide (SnS) to improve two-dimensional (2D) field-effect transistors (FETs). This strategy overcomes limitations in p-type contacts, enabling better performance for 2D complementary metal-oxide semiconductor (CMOS) technology.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Nanotechnology
Background:
- Two-dimensional (2D) semiconductors are crucial for next-generation electronics, but scalable p-type contacts remain a significant challenge for complementary metal-oxide semiconductor (CMOS) scaling.
- Existing methods using high-work-function metals often lead to Fermi-level pinning and high contact resistance, hindering device performance.
Purpose of the Study:
- To introduce a novel semiconductor-semiconductor van der Waals (S-S vdW) contact strategy for 2D materials.
- To overcome the limitations of traditional metal contacts for p-type 2D field-effect transistors (p-FETs).
Main Methods:
- Utilized tin sulfide (SnS) as a contact material for WSe2 transistors.
- Investigated the suppression of metal-induced gap states and defect-induced gap states through low-energy deposition of SnS.
- Characterized the electrical properties of SnS-WSe2 transistors.
Main Results:
- SnS contacts demonstrated minimal Fermi-level pinning and a negligible hole-injection barrier, outperforming conventional metal contacts (Pd, Pt).
- Achieved high on-off ratios (>10^10) and low contact resistance (395 Ω μm) in SnS-WSe2 transistors.
- Demonstrated high on-state current density (1.11 mA μm^-1) with a short channel length (60 nm).
Conclusions:
- The SnS S-S vdW contact strategy offers a practical and reliable approach for high-performance 2D p-FETs.
- This work paves the way for scalable integration of 2D materials into advanced CMOS technology.
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