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Bioinspired Reversible Adhesive with High Strength for Wearable Electronics under Diverse Environments.

Yihang Wu¹, Huiming Liu¹, Hongmiao Tian¹

¹Micro-and Nano-technology Research Center, State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Xi'an, Shaanxi 710049, China.

Research (Washington, D.C.)

|June 8, 2026

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Engineers developed a novel dual bioinspired adhesive for wearable electronics, mimicking geckos and octopuses. This advanced adhesive ensures robust, reversible attachment across diverse environments, enhancing device reliability.

Area of Science:

Materials Science
Bioinspired Engineering
Wearable Technology

Background:

Wearable electronics require reliable attachment for health monitoring and equipment assessment.
Existing adhesion methods struggle with high-strength, reversible bonding in diverse environmental conditions.

Purpose of the Study:

To design and fabricate a dual bioinspired adhesive microstructure for robust and reversible attachment of wearable devices.
To evaluate the adhesive's performance in various complex environments.

Main Methods:

Designed a dual bioinspired adhesive microstructure (annular stalk, microdome, annular tip).
Fabricated the microstructure using imprinting and photolithography.
Tested adhesion strength in vacuum, dry, moist, and underwater conditions.

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Main Results:

Achieved superior reversible normal adhesion in vacuum (120 kPa), dry (201 kPa), moist (173 kPa), and underwater (165 kPa).
Observed a unique crack reentry phenomenon inhibiting crack propagation and enhancing adhesion.
Demonstrated successful application in skin-attachable electronics across multiple environments.

Conclusions:

The bioinspired adhesive offers high-strength, reversible bonding adaptable to complex environments.
This technology has significant potential for advancing wearable flexible electronics in demanding applications.
The crack reentry mechanism is key to the adhesive's exceptional performance.