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Laser Micromachining of Liquid Metal Patterns for Stretchable Electronic Circuits
Merjen Palvanova1, Patrick McManigal2, Grace Fredrickson1
1Department of Mechanical & Materials Engineering, Smart Materials and Robotics Laboratory, University of Nebraska-Lincoln, Lincoln, USA.
Advanced Materials Technologies
|July 29, 2026
Summary
We developed a fast, low-cost method to create high-resolution stretchable electronic circuits using liquid metal. This technique enables advanced wearable devices and soft robotics through improved fabrication accessibility.
Area of Science:
- Materials Science
- Electronics Engineering
- Nanotechnology
Background:
- Stretchable electronic circuits are vital for wearable technology, soft robotics, and bio-integrated systems.
- Gallium-based liquid metals (LM) possess excellent electrical and mechanical properties but are challenging to pattern due to surface tension and adhesion issues.
Purpose of the Study:
- To develop a rapid, cost-effective, and high-resolution fabrication method for liquid metal (LM) circuits on diverse substrates.
- To demonstrate the utility of these circuits in wearable electronic devices.
Main Methods:
- A novel fabrication approach combining UV-laser micromachining with a copper foil wetting layer.
- Cleanroom-free processing enabling patterning on elastomers, fabrics, and adhesives.
- Hydrochloric acid vapor treatment for enhanced electrical interfacing and resolution (60 μm).
Main Results:
- Achieved rapid (<3 h) and cost-effective (~$15/device) fabrication of stretchable LM circuits.
- Demonstrated high-resolution patterning (60 μm) and functionality under >100% strain and cyclic loading.
- Successfully fabricated a wearable pulse oximeter for real-time heart rate monitoring.
Conclusions:
- The developed fabrication method significantly enhances the accessibility of stretchable LM-based electronics.
- This scalable, maskless approach facilitates rapid prototyping for next-generation wearable and soft robotic systems.
- The technique overcomes previous limitations in patterning and interfacing LM conductors.
