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Updated: Aug 2, 2026
08:46
Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
Published on: April 13, 2016
Dynamics of soldering reactions: microscopic observations
T J Singler1, J A Clum, E R Prack
1Mechanical and Industrial Engineering Department, T.J. Watson School of Engineering, State University of New York, Binghamton 13902-6000.
Microscopy Research and Technique
|August 1, 1993
Summary
Molten solder alloys segregate during spreading, forming a precursor film that advances ahead of the bulk material. This film reacts with metallization, influencing wetting and potentially causing dewetting if the metallization is too thin.
Area of Science:
- Materials Science
- Surface Science
- Microelectronic Engineering
Background:
- Solder spreading on microelectronic metallizations is critical for reliable interconnections.
- Understanding the dynamic reactions during solder spreading is essential for process optimization.
Purpose of the Study:
- To investigate the in situ, high-resolution mechanisms of solder spreading reactions on microelectronic circuit metallizations.
- To elucidate the role of precursor films and metallization reactivity in solder wetting behavior.
Main Methods:
- In situ environmental scanning electron microscopy (ESEM) for dynamic observation.
- Optical hot-stage microscopy for complementary visual analysis.
- Energy-dispersive X-ray microanalysis, Auger, and ESCA for chemical process evaluation.
Main Results:
- Molten solder alloys exhibit segregation, forming a "precursor" film that spreads ahead of the bulk solder.
- The spreading front, enriched in specific elements (Sn, In), moves along high-reactivity metallization features.
- Insufficient metallization thickness can lead to dissolution by solder, resulting in dewetting.
Conclusions:
- Solder spreading is a complex reactive process influenced by precursor film formation and metallization characteristics.
- Process temperature, solder/metallization composition, and reactivity are key factors controlling soldering outcomes.
- Further examination of spreading kinetics and wetting forces is needed for comprehensive understanding.
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