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Andong Chang

Showing results (1-10 of 5) with videos related to

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Micromachines|August 26, 2023
Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic PackagingYuemin Zhang, Haiyun Guo, Jun Cao, et al.
Micromachines|August 26, 2023
Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy WireHongliang Zhou, Andong Chang, Junling Fan, et al.
Micromachines|February 25, 2023
Research Progress on Bonding Wire for Microelectronic PackagingHongliang Zhou, Yingchong Zhang, Jun Cao, et al.
Micromachines|November 25, 2023
A Review of Silver Wire Bonding TechniquesBin An, Hongliang Zhou, Jun Cao, et al.
Micromachines|August 26, 2023
Copper Wire Bonding: A ReviewHongliang Zhou, Andong Chang, Junling Fan, et al.
Pageof 1

Showing results (1-10 of 5) with videos related to

Sort By:
Pageof 1
Micromachines|August 26, 2023
Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic PackagingYuemin Zhang, Haiyun Guo, Jun Cao, et al.
Micromachines|August 26, 2023
Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy WireHongliang Zhou, Andong Chang, Junling Fan, et al.
Micromachines|February 25, 2023
Research Progress on Bonding Wire for Microelectronic PackagingHongliang Zhou, Yingchong Zhang, Jun Cao, et al.
Micromachines|November 25, 2023
A Review of Silver Wire Bonding TechniquesBin An, Hongliang Zhou, Jun Cao, et al.
Micromachines|August 26, 2023
Copper Wire Bonding: A ReviewHongliang Zhou, Andong Chang, Junling Fan, et al.
Pageof 1