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Journal of Nanoscience and Nanotechnology|May 7, 2015
Microstructure and mechanical properties of ultrafine grained complex copper alloy fabricated by accumulative roll-bonding processSeong-Hee Lee, Cha-Yong LimJournal of Nanoscience and Nanotechnology|February 17, 2018
Evolution of Nanostructure Through Thickness of Deoxidized Low-Phosphorous Copper by Three-Layer Stack Accumulative Roll-BondingSeong-Hee Lee, Cha-Yong LimJournal of Nanoscience and Nanotechnology|April 2, 2011
Fabrication of nanostructured deoxidized low-phosphorous copper processed by three-layer stack accumulative roll-bondingSeong-Hee Lee, Hyoung-Wook Kim, Cha-Yong LimJournal of Nanoscience and Nanotechnology|April 3, 2010
Evolution of nano-grains in high purity copper by accumulative roll-bonding processSeong-Hee Lee, Hyoung-Wook Kim, Cha-Yong LimJournal of Nanoscience and Nanotechnology|January 27, 2007
Annealing characteristics of nano-grained oxygen free copper processed by accumulative roll-bonding processSeong-Hee Lee, Chung Hyo Lee, Seung Zeon Han, et al.Journal of Nanoscience and Nanotechnology|July 20, 2016
Microstructural Evolution of a Nanostructured Complex Copper Alloy Processed by Accumulative Roll-Bonding of Oxygen Free Copper and DLPSeong-Hee Lee, Seong Ro Lee, In-Sook Ahn, et al.Journal of Nanoscience and Nanotechnology|December 1, 2007
Nanostructured bulk copper fabricated by accumulative roll bondingNaoki Takata, Seong-Hee Lee, Cha-Yong Lim, et al.Journal of Nanoscience and Nanotechnology|December 1, 2007
Annealing characteristics of nanostructured Cu-Fe-P alloy processed by accumulative roll-bondingSeong-Hee Lee, Chung-Hyo Lee, Suk-Ja Yoon, et al.Pageof 1