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Jong-Ahn Kim

Showing results (1-10 of 19) with videos related to

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Optics Express|December 18, 2010
Visibility enhanced interferometer based on an injection-locking technique for low reflective materialsJonghan Jin, Jae Wan Kim, Chu-Shik Kang, et al.
The Review of Scientific Instruments|May 3, 2018
Note: An absolute X-Y-Θ position sensor using a two-dimensional phase-encoded binary scaleJong-Ahn Kim, Jae Wan Kim, Chu-Shik Kang, et al.
Optics Express|October 17, 2014
Fizeau-type interferometric probe to measure geometrical thickness of silicon wafersJonghan Jin, Saerom Maeng, Jungjae Park, et al.
Optics Express|February 3, 2016
Vibration-insensitive measurements of the thickness profile of large glass panelsJungjae Park, Jaeseok Bae, Jonghan Jin, et al.
Optics Express|March 16, 2012
Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging processJonghan Jin, Jae Wan Kim, Chu-Shik Kang, et al.
Optics Express|January 7, 2010
A passive method to compensate nonlinearity in a homodyne interferometerJeongho Ahn, Jong-Ahn Kim, Chu-Shik Kang, et al.
Optics Express|December 10, 2009
High resolution interferometer with multiple-pass optical configurationJeongho Ahn, Jong-Ahn Kim, Chu-Shik Kang, et al.
The Review of Scientific Instruments|May 3, 2019
High-resolution angle sensor using multiple peak positions of a double slit interference patternJong-Ahn Kim, Jae Wan Kim, Jae Yong Lee, et al.
The Review of Scientific Instruments|December 2, 2011
Note: high precision angle generator using multiple ultrasonic motors and a self-calibratable encoderJong-Ahn Kim, Jae Wan Kim, Chu-Shik Kang, et al.
Optics Express|August 20, 2010
Thickness and refractive index measurement of a silicon wafer based on an optical combJonghan Jin, Jae Wan Kim, Chu-Shik Kang, et al.
Pageof 2

Showing results (1-10 of 19) with videos related to

Sort By:
Pageof 2
Optics Express|December 18, 2010
Visibility enhanced interferometer based on an injection-locking technique for low reflective materialsJonghan Jin, Jae Wan Kim, Chu-Shik Kang, et al.
The Review of Scientific Instruments|May 3, 2018
Note: An absolute X-Y-Θ position sensor using a two-dimensional phase-encoded binary scaleJong-Ahn Kim, Jae Wan Kim, Chu-Shik Kang, et al.
Optics Express|October 17, 2014
Fizeau-type interferometric probe to measure geometrical thickness of silicon wafersJonghan Jin, Saerom Maeng, Jungjae Park, et al.
Optics Express|February 3, 2016
Vibration-insensitive measurements of the thickness profile of large glass panelsJungjae Park, Jaeseok Bae, Jonghan Jin, et al.
Optics Express|March 16, 2012
Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging processJonghan Jin, Jae Wan Kim, Chu-Shik Kang, et al.
Optics Express|January 7, 2010
A passive method to compensate nonlinearity in a homodyne interferometerJeongho Ahn, Jong-Ahn Kim, Chu-Shik Kang, et al.
Optics Express|December 10, 2009
High resolution interferometer with multiple-pass optical configurationJeongho Ahn, Jong-Ahn Kim, Chu-Shik Kang, et al.
The Review of Scientific Instruments|May 3, 2019
High-resolution angle sensor using multiple peak positions of a double slit interference patternJong-Ahn Kim, Jae Wan Kim, Jae Yong Lee, et al.
The Review of Scientific Instruments|December 2, 2011
Note: high precision angle generator using multiple ultrasonic motors and a self-calibratable encoderJong-Ahn Kim, Jae Wan Kim, Chu-Shik Kang, et al.
Optics Express|August 20, 2010
Thickness and refractive index measurement of a silicon wafer based on an optical combJonghan Jin, Jae Wan Kim, Chu-Shik Kang, et al.
Pageof 2