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Scientific Reports|January 13, 2024
Room temperature wafer bonding through conversion of polysilazane into [Formula: see text]Kai Takeuchi, Tadatomo Suga, Eiji Higurashi
Optics Express|September 22, 2011
Air-gap structure between integrated LiNbO3 optical modulators and micromachined Si substratesRyo Takigawa, Eiji Higurashi, Tadatomo Suga, et al.
Scientific Reports|April 9, 2021
Evidence for intermolecular forces involved in ladybird beetle tarsal setae adhesionNaoe Hosoda, Mari Nakamoto, Tadatomo Suga, et al.
Micromachines|May 25, 2019
Moiré-Based Alignment Using Centrosymmetric Grating Marks for High-Precision Wafer BondingBoyan Huang, Chenxi Wang, Hui Fang, et al.
ACS Applied Materials & Interfaces|January 28, 2020
Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond DevicesZhe Cheng, Fengwen Mu, Luke Yates, et al.
ACS Applied Materials & Interfaces|August 28, 2024
InP/LiNbO3 Covalent Heterointerface Construction via an Asymmetric Plasma Activation Strategy for Hybrid Integrated Quantum SystemsQiushi Kang, Han Yan, Fanfan Niu, et al.
Micromachines|July 29, 2023
Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System IntegrationMaria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, et al.
Drug Delivery and Translational Research|November 5, 2021
Microfluidic chip connected to porous microneedle array for continuous ISF samplingKai Takeuchi, Nobuyuki Takama, Kirti Sharma, et al.
Micromachines|June 2, 2021
A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low TemperatureJunlong Li, Yang Xu, Ying Meng, et al.
Micromachines|February 21, 2019
Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au⁻Au Bonding Using Ultrathin Au FilmsMichitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, et al.
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