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Wan-Chun Chuang

Showing results (1-10 of 5) with videos related to

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Materials (Basel, Switzerland)|January 11, 2022
Study on the Strip Warpage Issues Encountered in the Flip-Chip ProcessWan-Chun Chuang, Wei-Long Chen
Materials (Basel, Switzerland)|May 13, 2023
Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level PackagingWan-Chun Chuang, Yi Huang, Po-En Chen
Sensors (Basel, Switzerland)|December 14, 2012
CMOS-MEMS test-key for extracting wafer-level mechanical propertiesWan-Chun Chuang, Yuh-Chung Hu, Pei-Zen Chang
Sensors (Basel, Switzerland)|February 12, 2015
Strengthening of back muscles using a module of flexible strain sensorsWan-Chun Chuang, Hwai-Ting Lin, Wei-Long Chen
Sensors (Basel, Switzerland)|January 6, 2012
Review on the modeling of electrostatic MEMSWan-Chun Chuang, Hsin-Li Lee, Pei-Zen Chang, et al.
Pageof 1

Showing results (1-10 of 5) with videos related to

Sort By:
Pageof 1
Materials (Basel, Switzerland)|January 11, 2022
Study on the Strip Warpage Issues Encountered in the Flip-Chip ProcessWan-Chun Chuang, Wei-Long Chen
Materials (Basel, Switzerland)|May 13, 2023
Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level PackagingWan-Chun Chuang, Yi Huang, Po-En Chen
Sensors (Basel, Switzerland)|December 14, 2012
CMOS-MEMS test-key for extracting wafer-level mechanical propertiesWan-Chun Chuang, Yuh-Chung Hu, Pei-Zen Chang
Sensors (Basel, Switzerland)|February 12, 2015
Strengthening of back muscles using a module of flexible strain sensorsWan-Chun Chuang, Hwai-Ting Lin, Wei-Long Chen
Sensors (Basel, Switzerland)|January 6, 2012
Review on the modeling of electrostatic MEMSWan-Chun Chuang, Hsin-Li Lee, Pei-Zen Chang, et al.
Pageof 1