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Ultramicroscopy|July 22, 2023
Low energy electron microscopy at cryogenic temperaturesArash Tebyani, Sebastian Schramm, Marcel Hesselberth, et al.Ultramicroscopy|August 4, 2023
A precision dimple grinder-polisher produced by 3D printingLawrence WhitmoreUltramicroscopy|March 27, 2026
A calculation approach for the virtual source spatial distribution of sub-beams in single-emitter multi-electron-beam systemsJintao Hu, Yihao Ma, Lei Yue, et al.Ultramicroscopy|March 29, 2026
The third-order aberrations of magnetic sector analyzersMeishan Li, Hongqing Tao, Hangfeng Hu, et al.Ultramicroscopy|April 20, 2024
Ghostbuster: A phase retrieval diffraction tomography algorithm for cryo-EMJoel Yeo, Benedikt J Daurer, Dari Kimanius, et al.Ultramicroscopy|April 14, 2024
Strain visualization using large-angle convergent-beam electron diffractionFumihiko Uesugi, Chiaki Tanii, Naoyuki Sugiyama, et al.Ultramicroscopy|April 5, 2024
Adaptive under-sampling strategy for fast imaging in compressive sensing-based atomic force microscopyPeng Cheng, Yingzi Li, Rui Lin, et al.Ultramicroscopy|September 4, 2023
Scanning capacitance microscopy of GaN-based high electron mobility transistor structures: A practical guideChen Chen, Saptarsi Ghosh, Francesca Adams, et al.Ultramicroscopy|September 10, 2023
Relation between sampling, sensitivity and precision in strain mapping using the Geometric Phase Analysis method in Scanning Transmission Electron MicroscopyA Pofelski, Y Zhu, G A BottonUltramicroscopy|September 14, 2023
Importance of TEM sample thickness for measuring strain fieldsSangjun Kang, Di Wang, Christian Kübel, et al.Pageof 460