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Kun Chen

5PUBLICATIONS
4CO-AUTHORS
Electrical energy transmission, networks and systemsHydrometallurgyElemental semiconductorsElectrical energy storage
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Journal

Publications (5)

Sort by Publication Date:
|Sep 28, 2023
A Buried Thermal Rail (BTR) Technology to Improve Electrothermal Characteristics of Complementary Field-Effect Transistor (CFET).

Zhecheng Pan, Tao Liu, Jingwen Yang

|Aug 26, 2023
A Novel Atomic-Level Post-Etch-Surface-Reinforcement Process for High-Performance <i>p</i>-GaN Gate HEMTs Fabrication.

Luyu Wang, Penghao Zhang, Kaiyue Zhu

|Jun 28, 2023
Improving Performance of Al<sub>2</sub>O<sub>3</sub>/AlN/GaN MIS HEMTs via In Situ N<sub>2</sub> Plasma Annealing.

Mengyuan Sun, Luyu Wang, Penghao Zhang

|Mar 29, 2023
Impact of Stress and Dimension on Nanosheet Deformation during Channel Release of Gate-All-Around Device.

Jingwen Yang, Kun Chen, Dawei Wang

|Jul 27, 2022
Source/Drain Trimming Process to Improve Gate-All-Around Nanosheet Transistors Switching Performance and Enable More Stacks of Nanosheets.

Kun Chen, Jingwen Yang, Tao Liu

Pageof 1

Frequent Collaborators

3 joint publications

Tao Liu

2 joint publications

Xin Sun

1 joint publications

Chunlei Wu

1 joint publications

Chen Wang

Frequent Collaborators

3 joint publications

Tao Liu

2 joint publications

Xin Sun

1 joint publications

Chunlei Wu

1 joint publications

Chen Wang

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