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相关概念视频

Thermal Stress01:09

Thermal Stress

If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...
Thermal expansion and Thermal stress: Problem Solving01:27

Thermal expansion and Thermal stress: Problem Solving

San Francisco's Golden Gate Bridge is exposed to temperatures ranging from -15 °C to 40 °C. At its coldest, the main span of the bridge is 1275 m long. Assuming that the bridge is made entirely of steel, what is the change in its length between these temperatures?
To solve the problem, first, identify the known and unknown quantities. The initial length (L) of the bridge is 1275 m, the coefficient of linear expansion (α) for steel is 12 x 10-6/°C, and the change in temperature (ΔT) is 55 °C.
Temperature Dependent Deformation01:12

Temperature Dependent Deformation

In a nonhomogeneous rod made up of steel and brass, restrained at both ends and subjected to a temperature change, several steps are involved in calculating the stress and compressive load. Due to the problem's static indeterminacy, one end support is disconnected, allowing the rod to experience the temperature change freely. Next, an unknown force is applied at the free end, triggering deformations in the rod's steel and brass portions. These deformations are then calculated and added together...

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相关实验视频

Updated: Jul 8, 2026

In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices
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In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices

Published on: June 26, 2015

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一种用于温度诱导球网阵列崩观测的新方法.

Kristina Sorokina1, Karel Dušek1, David Bušek1

  • 1Faculty of Electrical Engineering, Czech Technical University in Prague, 16627 Prague, Czech Republic.

Materials (Basel, Switzerland)
|June 19, 2024
PubMed
概括

这项研究引入了一种新的方法,用于测量在重复回流过程中球网格阵列 (BGA) 接球的崩,揭示了对细度BGA的包装故障和短路的洞察力.

科学领域:

  • 材料科学 材料科学 材料科学
  • 电子工程 电子工程
  • 可靠性工程可靠性工程

背景情况:

  • 重复的回流接过程可以诱导球在球网格阵列 (BGA) 包中的球崩.
  • 这种崩是一个关键的故障机制,特别是在精细的BGA中,可能导致短路.
  • 现有的方法缺乏在现场测量接球在回流过程中的行为能力.

研究的目的:

  • 开发和验证一种新的现场测量方法,用于量化在重复回流过程中BGA球崩的数量.
  • 在不同的热循环条件下研究Sn63Pb37和SAC305合金的崩行为.
  • 为了将观察到的崩现象与短路等潜在故障模式相关联.

主要方法:

  • 开发了一种新的现场测量技术,用于监测BGA球在化和固化过程中崩.
  • 使用Sn63Pb37和SAC305接器的球网格阵列样本经过热力学分析 (TMA).
  • 样品经历了250°C,280°C和300°C的三个加热/冷却周期,然后冷却到100°C.

主要成果:

  • 新的TMA方法成功地捕获了Sn63Pb37和SAC305合金的现场接球崩行为.
  • 在测试温度的两种类型中,观察到崩特征的明显差异.
  • 在TMA测量中发现了电线之间的短路,后来通过X射线分析证实了这一点.
关键词:
球格子阵列 球格子阵列崩崩,崩崩,崩崩,崩崩,崩崩.导电桥是指导性桥梁.电气工程是电气工程.没有的无材料.微观结构的微观结构热机械分析仪 热机械分析仪

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结论:

  • 开发的新方法提供了明确的洞察力接球在重复回流过程中的行为,有助于理解BGA包的可靠性.
  • 这些发现突出了取决于温度的崩变化和微距BGA中短路的倾向.
  • 这种现场测量技术对于故障分析和开发更强大的电子包装解决方案非常有价值.