一种用于温度诱导球网阵列崩观测的新方法

Kristina Sorokina1, Karel Dušek1, David Bušek1

  • 1Faculty of Electrical Engineering, Czech Technical University in Prague, 16627 Prague, Czech Republic.

PubMed
概括

这项研究引入了一种新的方法,用于测量在重复回流过程中球网格阵列 (BGA) 接球的崩,揭示了对细度BGA的包装故障和短路的洞察力.

相关概念视频

Thermal Stress01:09

Thermal Stress

If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...