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Flexible Chip Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain
Nathan Jackson1, Jit Muthuswamy
1Harrington Department of Bioengineering, Arizona State University, Tempe, AZ 85287.
Journal of Microelectromechanical Systems : a Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems
|February 18, 2010
Summary
A novel MEMS microflex interconnect (MMFI) technology offers a reliable packaging solution for Bio-MEMS devices with movable brain-implanted electrodes. This innovation ensures mechanical isolation and operational space, demonstrating long-term stability.
Area of Science:
- Biomedical Engineering
- Microelectromechanical Systems (MEMS)
- Materials Science
Background:
- Bio-MEMS devices with movable microelectrodes require specialized packaging for brain tissue implantation.
- Existing packaging solutions often lack sufficient operating space or flexible interconnects for mechanical isolation.
Purpose of the Study:
- To introduce and validate a novel MEMS microflex interconnect (MMFI) technology for packaging Bio-MEMS.
- To address the critical needs for operating space and flexible interconnects in implantable Bio-MEMS.
Main Methods:
- Fabrication of a thin polyimide substrate with embedded interconnects and a thin-film cap.
- Utilized a double gold stud bump rivet bonding mechanism for electrical connections and spacing.
- Conducted reliability tests including high humidity, thermal cycling, thermal shock, and high temperature exposure.
Main Results:
- Achieved a lightweight, biocompatible chip-scale package (CSP) without underfill.
- Demonstrated minimal increases in contact resistance (<0.35 mΩ) under various environmental stresses.
- Gold bond pads showed significantly better high-temperature resistance compared to aluminum.
- Estimated mean-time-to-failure (MTTF) of at least one year under physiological conditions.
Conclusions:
- MMFI technology provides a feasible and reliable packaging solution for Bio-MEMS.
- The developed packaging ensures mechanical isolation and space for movable components.
- MMFI is suitable for next-generation implantable Bio-MEMS devices.
