Related Experiment Video
Updated: May 7, 2026
09:59
Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors
Published on: June 23, 2018
7.3K
Non-planar and flexible chip technology for biomedical applications.
Summary
We developed a new flexible silicon chip technology that uses residual stress to create 3D shapes. This innovation enables conformable electronics for biomedical applications, like a contact lens-shaped image sensor.
Area of Science:
- Materials Science
- Electrical Engineering
- Biomedical Engineering
Background:
- Traditional silicon chips are rigid and planar.
- Integrating electronics with soft or curved biological surfaces is challenging.
Purpose of the Study:
- To develop a novel non-planar, flexible silicon chip technology.
- To enable new biomedical applications by creating conformable electronic devices.
Main Methods:
- Patterning thin films with high residual stress on shaped silicon substrates.
- Utilizing the stress to induce designed three-dimensional chip deformation.
- Employing packaging techniques with constraining elements like polymer rings to maintain curvature.
Main Results:
- Successfully fabricated patterned stress films and "petal-like" chips.
- Achieved large chip curvatures through stress engineering and packaging.
- Demonstrated a CMOS image-sensing retina chip in a contact-lens shape (12.5 m radius).
Conclusions:
- This non-planar flexible chip technology offers a unique interface for soft or non-planar biological surfaces.
- The technology opens new avenues for diverse biomedical applications.
- The stress-patterning approach allows for precise control over chip geometry and flexibility.
