An Universal packaging technique for low-drift implantable pressure sensors

Albert Kim1,2, Charles R Powell3, Babak Ziaie4,5

  • 1School of Electrical and Computer Engineering, Purdue University, 1205 W. State St, West Lafayette, IN, 47907, USA. Albert.Kim.1@Purdue.Edu.

Summary

A novel packaging technique significantly reduces implantable pressure sensor drift by isolating sensors in a silicone-filled balloon. This innovation ensures stable, long-term monitoring crucial for medical diagnostics.

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