A GENERIC PACKAGING TECHNIQUE USING FLUIDIC ISOLATION FOR LOW-DRIFT IMPLANTABLE PRESSURE SENSORS

A Kim1, C R Powell2, B Ziaie1

  • 1Birck Nanotechnology Center, Purdue University, West Lafayette, IN, USA.

International Solid-State Sensors, Actuators and Microsystems Conference : [Proceedings]. International Conference on Solid-State Sensors, Actuators, and Microsystems
|November 22, 2016
PubMed

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