LONG-TERM EVALUATION OF A NON-HERMETIC MICROPACKAGE TECHNOLOGY FOR MEMS-BASED, IMPLANTABLE PRESSURE SENSORS

P Wang1, S J A Majerus1,2, R Karam1,2

  • 1Electrical Engineering, Case School of Engineering, Case Western Reserve University, Cleveland, OH, USA.

International Solid-State Sensors, Actuators and Microsystems Conference : [Proceedings]. International Conference on Solid-State Sensors, Actuators, and Microsystems
|April 26, 2021
PubMed

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