Nanometric Cutting of Silicon with an Amorphous-Crystalline Layered Structure: A Molecular Dynamics Study

Materials with specific nanometric layers are of great value in both theoretical and applied research. The nanometric layer could have a significant influence on the response to the mechanical loading. In this paper, the nanometric cutting on the layered systems of silicon has been studied by molecular dynamics. This kind of composite structure with amorphous layer and crystalline substrate is important for nanomachining. Material deformation, stress status, and chip formation, which are the key issues in nano-cutting, are analyzed. A new chip formation mechanism, i.e., the mixture of extrusion and shear, has been observed. In addition, from the perspective of engineering, some specific composite models show the desired properties due to the low subsurface damage or large material removal rate. The results enrich the cutting theory and provide guidance on nanometric machining.