Related Experiment Video
Updated: Feb 23, 2026

06:17
Production of a Strain-Measuring Device with an Improved 3D Printer
Published on: January 30, 2020
6.5K
Strain measurement of 3D structured nanodevices by EBSD
William Osborn1, Lawrence H Friedman1, Mark Vaudin1
1Materials Measurement Science Division, NIST, Gaithersburg, MD, United States.
Ultramicroscopy
|September 2, 2017
Summary
We developed a new method to measure strain in 3D nanodevices using Electron Backscatter Diffraction (EBSD). This technique accurately quantifies strain in nanoscale structures, overcoming limitations of traditional methods.
Area of Science:
- Materials Science
- Nanotechnology
- Crystallography
Background:
- Electron Backscatter Diffraction (EBSD) is a powerful technique for analyzing material microstructures.
- Accurate strain measurement in 3D nanodevices is challenging due to the small feature sizes relative to the electron interaction volume.
- Superposition of EBSD patterns from multiple regions in 3D nanostructures complicates traditional strain analysis.
Purpose of the Study:
- To present a novel methodology for accurate strain magnitude measurement in 3D nanodevices using EBSD.
- To address the limitations imposed by pattern superposition in nanoscale EBSD analysis.
- To enable high-resolution, non-destructive strain quantification in 3D nanostructures.
Main Methods:
- Demonstration of the effect of pattern superposition on EBSD strain measurements.
- Development and application of a pattern subtraction approach to separate superimposed EBSD signals.
- Validation of the subtraction method on 33 nm wide SiGe lines.
Main Results:
- The proposed subtraction method successfully separates EBSD patterns from superimposed signals in 3D nanodevices.
- Accurate strain magnitudes were obtained for 33 nm SiGe lines using the new technique.
- Traditional EBSD strain analysis significantly undervalued strain magnitudes by an order of magnitude in these structures.
Conclusions:
- The developed subtraction technique provides an accurate and reliable method for strain measurement in 3D nanodevices.
- This approach overcomes the limitations of conventional EBSD strain analysis at the nanoscale.
- The methodology offers a high spatial resolution, non-destructive, and accurate strain measurement solution for nanoscale 3D structures.

