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Reusable High Aspect Ratio 3-D Nickel Shadow Mask.

M M H Shandhi1, M Leber1, A Hogan2

  • 1Department of Electrical and Computer Engineering, University of Utah, Salt Lake City, UT, USA.

Journal of Microelectromechanical Systems : a Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems
|October 24, 2017
PubMed
Summary
This summary is machine-generated.

This study introduces a novel, reusable 3D Nickel (Ni) shadow mask for high aspect ratio patterning. This robust Ni shadow mask simplifies the fabrication of complex microstructures like neural electrodes.

Keywords:
3D Shadow MaskHigh Aspect RatioMicroneedleNeural ElectrodesStencil

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Area of Science:

  • Microfabrication
  • Materials Science
  • Biomedical Engineering

Background:

  • Shadow mask technology enables resistless patterning on diverse substrates.
  • Existing methods face limitations with complex 3D geometries and fragile materials.

Purpose of the Study:

  • To develop a novel, high aspect ratio, three-dimensional (3D) Nickel (Ni) shadow mask.
  • To demonstrate its application in patterning complex 3D structures with enhanced site density.

Main Methods:

  • Fabrication of a 3D Ni shadow mask using laser patterning and electroplating.
  • Achieving a high aspect ratio of 15:1 with specific dimensions (1.2 mm length, 40 μm width).

Main Results:

  • A mechanically robust and reusable Ni shadow mask (1.5 mm tall, 100 μm base width) was successfully fabricated.
  • Demonstrated application in patterning sidewalls of complex geometries, increasing Utah array active sites from 100 to 300.

Conclusions:

  • The novel Ni 3D shadow mask offers a cost-effective, simpler, and faster method for patterning out-of-plane structures.
  • Enables enhanced functionality for devices like neural electrodes and microneedles.