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Hybrid Printing for the Fabrication of Smart Sensors
Published on: January 31, 2019
Smart CMOS mid-infrared sensor array
We developed a new single-chip thermopile sensor array for mid-infrared imaging. This low-cost, compact sensor offers high performance for applications like gesture recognition.
Area of Science:
- Materials Science
- Electrical Engineering
- Sensor Technology
Background:
- Mid-infrared imaging requires compact, cost-effective sensors.
- Existing thermopile arrays often face challenges with size and fabrication complexity.
Purpose of the Study:
- To introduce a novel single-chip thermopile sensor array for mid-infrared room temperature imaging.
- To demonstrate a compact and simplified fabrication process for thermopile arrays.
Main Methods:
- Fabrication on a single complementary metal-oxide-semiconductor (CMOS) dielectric membrane.
- Utilizing single-crystal silicon (Si) p+ and n+ elements.
- Employing standard CMOS tungsten metal layers for cold junction heatsinking.
Main Results:
- Demonstrated a 16x16 pixel device with 34 V/W responsivity.
- Achieved enhanced optical absorption in the 8-14 μm waveband.
- Sensor performance is suitable for gesture recognition and people-counting.
Conclusions:
- The developed sensor array is simple, low-cost, and compact.
- It offers attractive on-chip capabilities for mid-infrared applications.
- The technology is well-suited for real-time imaging tasks.
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