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Localized Heating and Switching in MoTe2-Based Resistive Memory Devices.
Isha M Datye1, Miguel Muñoz Rojo1, Eilam Yalon1
1Department of Electrical Engineering , Stanford University , Stanford , California 94305 , United States.
Nano Letters
|January 18, 2020
Summary
Researchers investigated resistive memory devices using two-dimensional (2D) materials like MoTe2. Localized heating at conductive plugs, formed by atomic migration, drives the switching mechanism in these advanced memory devices.
Area of Science:
- Materials Science
- Nanoscience
- Solid-State Electronics
Background:
- Two-dimensional (2D) materials offer unique properties for advanced electronic devices.
- Resistive memory devices are crucial for next-generation data storage.
- The switching mechanisms in 2D material-based memory are not fully understood.
Purpose of the Study:
- To investigate the bipolar switching mechanism in molybdenum ditelluride (MoTe2)-based resistive memory devices.
- To understand the role of localized heating and conductive plug formation.
- To correlate experimental thermal measurements with electro-thermal simulations.
Main Methods:
- Utilized scanning thermal microscopy (SThM) to map surface temperature during device operation.
- Performed electro-thermal simulations to model heat distribution and plug characteristics.
- Employed transmission electron microscopy (TEM) to visualize the conductive plugs at the atomic level.
Main Results:
- Identified localized heating at conductive plugs formed during bipolar switching in MoTe2 devices.
- Determined plug diameters ranging from 250 to 350 nm through SThM and simulations.
- Observed that conductive plugs result from thermally-activated atomic migration between electrodes.
Conclusions:
- Provided the first thermal and localized insights into the switching mechanism of 2D material-based resistive memory.
- Demonstrated that atomic migration, a thermally-activated process, forms conductive plugs.
- Highlighted SThM as a valuable technique for analyzing both traditional and emerging memory devices.
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