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A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer

Seyed Amir Fouad Farshchi Yazdi1, Matteo Garavaglia2, Aldo Ghisi1

  • 1Department of Civil and Environmental Engineering, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133 Milano, Italy.

Micromachines
|April 3, 2021
PubMed

Keywords:
finite element analysisglass frit bondingresidual stresswarpage

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