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An Assessment of Local Geometric Uncertainties in Polysilicon MEMS: A Genetic Algorithm and POD-Kriging Surrogate

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Summary

Quantifying geometric uncertainties is crucial for microelectromechanical systems (MEMS) miniaturization. This study presents a novel method using genetic algorithms and proper orthogonal decomposition to predict over-etch variations in MEMS devices, improving manufacturing accuracy.

Keywords:
genetic algorithm (GA)kriging interpolationmicro electro-mechanical systems (MEMS)over-etchingproper orthogonal decomposition (POD)uncertainty quantification

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Area of Science:

  • Engineering
  • Materials Science
  • Nanotechnology

Background:

  • Microelectromechanical systems (MEMS) miniaturization faces challenges in quantifying geometric uncertainties.
  • Variations in MEMS device geometry, even under identical manufacturing conditions, lead to different responses.
  • Over-etch measures represent a critical geometric uncertainty in MEMS fabrication.

Purpose of the Study:

  • To develop and validate an accurate method for predicting over-etch measures in MEMS devices.
  • To quantify geometric uncertainties within and between MEMS dies.
  • To establish a link between capacitance-voltage response and geometric variations.

Main Methods:

  • A hybrid approach combining genetic algorithms (GAs), proper orthogonal decomposition (POD), and kriging surrogate modeling.
  • Utilizing an on-chip test device to measure capacitance-voltage response.
  • Statistical analysis of a batch of tested MEMS devices.

Main Results:

  • The proposed method accurately predicts over-etch measures using only capacitance-voltage data.
  • Geometric uncertainties (over-etch values) vary significantly both between and within MEMS dies.
  • Quantified mean over-etch values: +12.2% at comb fingers, +10.0% at supporting springs, and -4.8% at stoppers.
  • Demonstrated noteworthy environmental influence on MEMS variability.

Conclusions:

  • The developed method offers an effective alternative for estimating uncertainties in MEMS devices.
  • Accurate quantification of geometric uncertainties is essential for reliable MEMS performance.
  • Understanding and controlling over-etch variations are key to advancing MEMS technology.