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MEMS Reliability: On-Chip Testing for the Characterization of the Out-of-Plane Polysilicon Strength.

Tiago Vicentini Ferreira do Valle¹, Stefano Mariani¹, Aldo Ghisi¹

¹Department of Civil and Environmental Engineering, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133 Milano, Italy.

|February 25, 2023

Summary

This study measured the out-of-plane tensile strength of columnar polysilicon, a brittle material. Results show a strength of 2.8-3.0 GPa, consistent with existing literature, by combining novel on-chip testing and simulations.

Keywords:

MEMS stopper brittle materials fracture polysilicon tensile strength

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Area of Science:

Materials Science
Mechanical Engineering
Solid Mechanics

Background:

Polycrystalline silicon is a brittle material.
Its strength is influenced by microscale defects, grain size, and morphology.

Purpose of the Study:

To determine the out-of-plane tensile strength of columnar polysilicon.
To investigate the failure mechanisms under static loading.

Main Methods:

Developed a novel on-chip testing setup utilizing electrostatic actuation.
Performed finite element analyses to interpret experimental data.
Applied Weibull theory for data interpretation across different stopper sizes.

Main Results:

Observed failure mechanisms were successfully captured by numerical simulations.
Estimated the reference out-of-plane tensile strength of polysilicon to be 2.8-3.0 GPa.
Results align with previously reported values in scientific literature.

Conclusions:

The study provides a reliable estimation of polysilicon's tensile strength.
The combined experimental and numerical approach validates the testing methodology.
Findings contribute to understanding polysilicon's mechanical behavior for applications.