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Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration"
1Center for Nanoscience and Nanotechnology (C2N), University-Paris-Saclay, 91400 Orsay, France.
Micromachines
|May 28, 2022
Summary
Advancing fabrication technologies drive MEMS packaging development in two key areas: device packaging and system integration. This ensures enhanced performance and miniaturization for microelectromechanical systems.
Area of Science:
- Engineering
- Materials Science
- Nanotechnology
Background:
- Microelectromechanical systems (MEMS) fabrication technologies are rapidly advancing.
- Packaging is a critical aspect of MEMS development, influencing performance and reliability.
- Current trends focus on two primary directions for MEMS packaging.
