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Large-scale and high-depth three dimensional scanning measurement system and algorithm optimization.

Fan Zhang1, ZhenYang Li1, Liansheng Zhang1

  • 1School of Instrument Science and Opto-electronic Engineering, Hefei University of Technology, Hefei 230009, China.

The Review of Scientific Instruments
|June 1, 2022
PubMed
Summary
This summary is machine-generated.

This study introduces a new 3D scanning system using a quartz tuning fork and tungsten stylus for high-resolution surface topography measurement. A novel sliding window algorithm improves accuracy and efficiency for microstructures.

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Area of Science:

  • Nanotechnology
  • Surface Metrology
  • Microdevice Characterization

Background:

  • Tapping scanning mode is crucial for nanometer-scale surface topography measurement, offering reduced sample damage and lateral force elimination.
  • Existing scanning probe microscopes have limitations in measurement range and Z-direction ability, hindering the study of high aspect ratio microstructures.
  • There is a significant need for advanced 3D scanning technologies with large ranges and high depth-to-width ratios for practical engineering applications.

Purpose of the Study:

  • To develop a novel 3D scanning measurement system capable of high-resolution topography measurement of microdevices with large aspect ratios.
  • To enhance scanning efficiency and accuracy using a new sliding window algorithm (SWA).
  • To provide a reliable method for characterizing microfluidic biochips and other microstructures.

Main Methods:

  • Utilized a quartz tuning fork with high-frequency resonance and a tungsten stylus for the scanning probe.
  • Developed a 3D scanning measurement system with a total measuring range of 400 × 400 × 400 µm³ and a vertical resolution of 0.28 nm.
  • Implemented a sliding window algorithm (SWA) to address scanning errors and improve efficiency compared to traditional point-by-line methods.

Main Results:

  • Achieved microstructure measurement with a depth of approximately 58 µm.
  • The system accurately captured the 3D surface topography of a microfluidic biochip.
  • The proposed SWA reduced the mean squared residuals of the 3D profile by 7.70% compared to the point-by-line scanning algorithm.

Conclusions:

  • The developed 3D scanning measurement system effectively measures the 3D surface topography of microstructures with large aspect ratios.
  • The sliding window algorithm demonstrates improved accuracy and efficiency in scanning processes.
  • This technology offers a valuable reference for 3D topography measurements in microdevice characterization.