Updated: Jul 10, 2026

Residue-Free Fabrication of van der Waals Heterostructures of Two-Dimensional Materials
Published on: July 18, 2025
Chang Liu1, Shuimei Ding2, Xudong Wang3
1State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China; College of Semiconductors (College of Integrated Circuits), Hunan University, Changsha 410082, China.
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A new elastic bevel stamp-assisted thermal lamination (EBTL) method achieves ultra-clean interfaces for two-dimensional (2D) electronics by actively expelling contaminants. This technique enables high-yield fabrication of high-performance 2D stacked devices and complex integrated circuits.
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