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Hyoungho Ko

Showing results (1-10 of 21) with videos related to

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Sensors (Basel, Switzerland)|November 30, 2016
Reconfigurable Multiparameter Biosignal Acquisition SoC for Low Power Wearable PlatformJongpal Kim, Hyoungho Ko
Sensors (Basel, Switzerland)|January 6, 2016
Low-Power Photoplethysmogram Acquisition Integrated Circuit with Robust Light Interference CompensationJongpal Kim, Jihoon Kim, Hyoungho Ko
Sensors (Basel, Switzerland)|August 1, 2018
0.6 V, 116 nW Neural Spike Acquisition IC with Self-Biased Instrumentation Amplifier and Analog Spike ExtractionJong Pal Kim, Hankyu Lee, Hyoungho Ko
Sensors (Basel, Switzerland)|October 6, 2015
Fully Integrated Biopotential Acquisition Analog Front-End ICHaryong Song, Yunjong Park, Hyungseup Kim, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|January 7, 2016
Ambient light cancellation in photoplethysmogram application using alternating sampling and charge redistribution techniqueJongpal Kim, Takhyung Lee, Jihoon Kim, et al.
Sensors (Basel, Switzerland)|December 14, 2011
Optimal and robust design method for two-chip out-of-plane microaccelerometersSangmin Lee, Hyoungho Ko, Byoungdoo Choi, et al.
Bio-Medical Materials and Engineering|September 26, 2015
Analog front-end measuring biopotential signal with effective offset rejection loopSeunghyun Lim, Hyunho Kim, Haryong Song, et al.
Sensors (Basel, Switzerland)|October 17, 2015
Fully integrated low-noise readout circuit with automatic offset cancellation loop for capacitive microsensorsHaryong Song, Yunjong Park, Hyungseup Kim, et al.
Technology and Health Care : Official Journal of the European Society for Engineering and Medicine|October 25, 2017
Biosignal integrated circuit with simultaneous acquisition of ECG and PPG for wearable healthcare applicationsHyungseup Kim, Yunjong Park, Youngwoon Ko, et al.
Micromachines|July 27, 2022
Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave ApplicationsJongwon Lee, Jae Yong Lee, Jonghyun Song, et al.
Pageof 3

Showing results (1-10 of 21) with videos related to

Sort By:
Pageof 3
Sensors (Basel, Switzerland)|November 30, 2016
Reconfigurable Multiparameter Biosignal Acquisition SoC for Low Power Wearable PlatformJongpal Kim, Hyoungho Ko
Sensors (Basel, Switzerland)|January 6, 2016
Low-Power Photoplethysmogram Acquisition Integrated Circuit with Robust Light Interference CompensationJongpal Kim, Jihoon Kim, Hyoungho Ko
Sensors (Basel, Switzerland)|August 1, 2018
0.6 V, 116 nW Neural Spike Acquisition IC with Self-Biased Instrumentation Amplifier and Analog Spike ExtractionJong Pal Kim, Hankyu Lee, Hyoungho Ko
Sensors (Basel, Switzerland)|October 6, 2015
Fully Integrated Biopotential Acquisition Analog Front-End ICHaryong Song, Yunjong Park, Hyungseup Kim, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|January 7, 2016
Ambient light cancellation in photoplethysmogram application using alternating sampling and charge redistribution techniqueJongpal Kim, Takhyung Lee, Jihoon Kim, et al.
Sensors (Basel, Switzerland)|December 14, 2011
Optimal and robust design method for two-chip out-of-plane microaccelerometersSangmin Lee, Hyoungho Ko, Byoungdoo Choi, et al.
Bio-Medical Materials and Engineering|September 26, 2015
Analog front-end measuring biopotential signal with effective offset rejection loopSeunghyun Lim, Hyunho Kim, Haryong Song, et al.
Sensors (Basel, Switzerland)|October 17, 2015
Fully integrated low-noise readout circuit with automatic offset cancellation loop for capacitive microsensorsHaryong Song, Yunjong Park, Hyungseup Kim, et al.
Technology and Health Care : Official Journal of the European Society for Engineering and Medicine|October 25, 2017
Biosignal integrated circuit with simultaneous acquisition of ECG and PPG for wearable healthcare applicationsHyungseup Kim, Yunjong Park, Youngwoon Ko, et al.
Micromachines|July 27, 2022
Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave ApplicationsJongwon Lee, Jae Yong Lee, Jonghyun Song, et al.
Pageof 3