Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Filters

Kuan-Neng Chen

Showing results (1-10 of 17) with videos related to

Pageof 2
Sort By:
Nanoscale Research Letters|January 21, 2017
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)Wen-Wei Shen, Kuan-Neng Chen
Nanotechnology|March 9, 2010
The fabrication of a programmable via using phase-change material in CMOS-compatible technologyKuan-Neng Chen, Lia Krusin-Elbaum
Journal of Nanoscience and Nanotechnology|February 17, 2018
A Novel Method of Electrical Measurement for Stacking Error in 3D/2.5D IntegrationShih-Wei Lee, Shu-Chiao Kuo, Kuan-Neng Chen
Journal of Nanoscience and Nanotechnology|February 21, 2013
Effects of bonding technology and thinning process in three-dimensional integration on device characteristicsCheng-Hsien Lu, Chuan-An Cheng, Chia-Hua Ho, et al.
Journal of Nanoscience and Nanotechnology|February 21, 2018
Asymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-Thin Buffer LayerTing-Yang Yu, Hao-Wen Liang, Yao-Jen Chang, et al.
Nanomaterials (Basel, Switzerland)|September 9, 2023
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) ApplicationYuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung, et al.
Journal of Nanoscience and Nanotechnology|July 5, 2012
Adhesive selection and bonding parameter optimization for hybrid bonding in 3D integrationKuan-Neng Chen, Cheng-Ta Ko, Zhi-Cheng Hsiao, et al.
Nanoscale Research Letters|October 18, 2014
Quartz resonator assembling with TSV interposer using polymer sealing or metal bondingJian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, et al.
Optics Letters|December 8, 2017
Robust terahertz polarizers with high transmittance at selected frequencies through Si wafer bonding technologiesTing-Yang Yu, Nai-Chen Chi, Hsin-Cheng Tsai, et al.
Nutrients|February 25, 2016
Sake Protein Supplementation Affects Exercise Performance and Biochemical Profiles in Power-Exercise-Trained MiceYi-Ming Chen, Che-Li Lin, Li Wei, et al.
Pageof 2

Showing results (1-10 of 17) with videos related to

Sort By:
Pageof 2
Nanoscale Research Letters|January 21, 2017
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)Wen-Wei Shen, Kuan-Neng Chen
Nanotechnology|March 9, 2010
The fabrication of a programmable via using phase-change material in CMOS-compatible technologyKuan-Neng Chen, Lia Krusin-Elbaum
Journal of Nanoscience and Nanotechnology|February 17, 2018
A Novel Method of Electrical Measurement for Stacking Error in 3D/2.5D IntegrationShih-Wei Lee, Shu-Chiao Kuo, Kuan-Neng Chen
Journal of Nanoscience and Nanotechnology|February 21, 2013
Effects of bonding technology and thinning process in three-dimensional integration on device characteristicsCheng-Hsien Lu, Chuan-An Cheng, Chia-Hua Ho, et al.
Journal of Nanoscience and Nanotechnology|February 21, 2018
Asymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-Thin Buffer LayerTing-Yang Yu, Hao-Wen Liang, Yao-Jen Chang, et al.
Nanomaterials (Basel, Switzerland)|September 9, 2023
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) ApplicationYuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung, et al.
Journal of Nanoscience and Nanotechnology|July 5, 2012
Adhesive selection and bonding parameter optimization for hybrid bonding in 3D integrationKuan-Neng Chen, Cheng-Ta Ko, Zhi-Cheng Hsiao, et al.
Nanoscale Research Letters|October 18, 2014
Quartz resonator assembling with TSV interposer using polymer sealing or metal bondingJian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, et al.
Optics Letters|December 8, 2017
Robust terahertz polarizers with high transmittance at selected frequencies through Si wafer bonding technologiesTing-Yang Yu, Nai-Chen Chi, Hsin-Cheng Tsai, et al.
Nutrients|February 25, 2016
Sake Protein Supplementation Affects Exercise Performance and Biochemical Profiles in Power-Exercise-Trained MiceYi-Ming Chen, Che-Li Lin, Li Wei, et al.
Pageof 2