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Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
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Solution-processable electrode-material embedding in dynamically inscribed nanopatterns (SPEEDIN) for continuous
Wonseok Lee1, Hyoungseok Chae1, Dong Kyo Oh2
1Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology, Seoul, 01811 Republic of Korea.
Microsystems & Nanoengineering
|October 11, 2021
Summary
A new SPEEDIN fabrication method creates durable electronics using dynamic nanoinscribing and metal nanoparticle embedding. This lithography-free technique offers robust, power-efficient performance for flexible devices in harsh environments.
Area of Science:
- Materials Science
- Nanotechnology
- Electronics Manufacturing
Background:
- Traditional electronics fabrication often relies on complex lithography.
- There is a need for robust and scalable methods to produce durable flexible electronics.
- Existing methods may lack efficiency or durability under extreme conditions.
Purpose of the Study:
- To develop a facile, scalable, and lithography-free fabrication technique for highly durable electronics.
- To demonstrate the effectiveness of the SPEEDIN process for creating reliable flexible electrodes.
- To enable the production of electronics for heavy-duty applications in harsh environments.
Main Methods:
- Developed a continuous flow-line manufacturing process named SPEEDIN (solution-processable electrode-material embedding in dynamically inscribed nanopatterns).
- Utilized dynamic nanoinscribing to create trenches in polymers.
- Employed selective embedding of silver nanoparticle solutions into these trenches via coating, baking, and doctor-blading.
Main Results:
- Achieved higher durability compared to lithographically embossed structures with comparable optical and electrical properties.
- Demonstrated robust and power-efficient performance even under extreme stresses like scratching and bending.
- Fabricated a flexible metal electrode operable at 5V up to 300°C under harsh stimuli.
Conclusions:
- SPEEDIN offers a scalable, lithography-free approach for fabricating highly durable electronics.
- The embedded SPEEDIN architectures are reliable for heavy-duty operation in demanding environments.
- This technique is applicable to a wide range of flexible devices requiring resilience to heat, deformation, and chemicals.
