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Balancing the Efficiency and Sensitivity of Defect Inspection of Non-Patterned Wafers with TDI-Based Dark-Field

Fei Yu1, Min Xu1, Junhua Wang1,2

  • 1Shanghai Engineering Research Center of Ultra-Precision Optical Manufacturing, School of Information Science and Technology, Fudan University, Shanghai 200438, China.

Sensors (Basel, Switzerland)
|March 13, 2024
PubMed

Keywords:
dark-field microscopynon-patterned wafer inspectionoptical inspectiontime delay integration

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