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Published on: October 2, 2016
A Correlative ToF-SIMS/SPM Methodology for Probing 3D Devices.
Valentina Spampinato1, Masoud Dialameh2, Alexis Franquet1
1IMEC, Kapeldreef 75, 3001 Leuven, Belgium.
Integrating a Scanning Probe Microscope (SPM) with Time of Flight Secondary Ion Mass Spectrometry (ToF-SIMS) improves 3D chemical imaging accuracy. This approach addresses challenges in nanotechnology characterization by providing high-resolution topographical data alongside chemical analysis.
Area of Science:
- Nanotechnology
- Materials Science
- Surface Science
Background:
- Miniaturization and complexity of nanodevices necessitate nm-scale 3D-spatial resolution characterization.
- Secondary Ion Mass Spectrometry (SIMS) lacks sufficient lateral resolution for advanced nanotechnology.
- Topographical changes during 3D SIMS analysis, caused by differential sputtering, hinder accurate 3D chemical imaging.
Purpose of the Study:
- To develop and evaluate a combined Scanning Probe Microscope (SPM) and Time of Flight Secondary Ion Mass Spectrometry (ToF-SIMS) system.
- To overcome limitations in lateral resolution and topographical artifacts in 3D SIMS analysis.
- To enable accurate 3D chemical imaging of complex nanostructured materials.
Main Methods:
- Integration of a SPM module into a ToF-SIMS instrument.
- Alternating between SPM topography measurements and ToF-SIMS chemical analysis during depth profiling.
- Capturing time and spatially dependent surface erosion with high spatial resolution.
Main Results:
- The integrated SPM-ToF-SIMS system successfully acquired high-resolution topographical data.
- Demonstrated ability to correlate topographical changes with sputtering time and material composition.
- Significant improvements in the accuracy of 3D chemical imaging for complex systems were achieved.
Conclusions:
- Combining SPM and ToF-SIMS provides complementary topographical information essential for accurate 3D chemical analysis.
- The developed approach effectively mitigates artifacts arising from differential sputtering rates.
- This integrated technique offers a powerful solution for characterizing complex 3D nanostructures.
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